Current and Future trends in Microelectromechnical Systems Case Study

Current and succeeding(a) trends in Microelectromechnical Systems - Case Study Examplecessing, and data acquisition features.2 The term MEMS refer to the devices that are on a millimetre scale with micro-resolution. It is the integration of mechanical elements, sensors, actuators and electronics on common silicon substrate done the utilization of microfabrication technology 8.There are several broad categories of MEMS fabrication technologies. They are Bulk micromachining, climb up micromachining, LIGA, Deep reactive ion etching and the coordinated MEMS technologies. The brief 9 of each of the technologies is given belowBulk micromachining is a fabrication technique which builds mechanical elements by starting with a silicon wafer, and then etching absent unwanted parts, and being left with useful mechanical devices 9.The advantages are less exist high reliability, manufacturability, and faithful repeatability 9. Surface Micromachining builds devices up from the wafer layer-by -layer 9. Surface Micromachining requires more fabrication steps than Bulk Micromachining, and hence is more expensive. It is adapted to create much more complicated devices, capable of sophisticated functionality. LIGA is a technology which creates small, but comparatively high aspect ratio devices using x-ray lithography 9. Unlike traditional Bulk Micromachining, which uses a squiffy chemical etch, Deep Reactive Ion Etching micromachining usesa plasma etch to create features allowing greater flexibility in the etch profiles, enabling a wider array of mechanical elements 9. Since MEMS devices are created with the same tools used to create integrated circuits, in some cases it is also possible to fabricate Micro-machines and Microelectronics on the same piece of silicon 9. literary works REVIEWMEMS has a very wide range of applications, particularly of its sensors which are used many of the automotive, checkup and other consumer products. The technology development is immense an d there are several in the literature to ingeminate from in evidence of this fact. The MEMS related technology and literature work is very huge and hence causal agency has been made only to cover the key developments from random authors.One technique developed in the linked States at the University of Wisconsin uses thin film polysilicon for the sensor diaphragm 3. The polysilicon devices are correspondingly smaller and hence they cost less. Another technique, result in much smaller sensor dies than standard bulk micromachining techniques NovaSensor in the unite States, employs high temperature fusion bonding of silicon wafers to form inward tapering cavities under single watch glass silicon diaphragms 4. These devices are used in medical catheters.An improvement in low pressure amount has also been suggested as by using advanced MEMS micromachining